Holder for surface mount device during reflow

ABSTRACT

Methods and apparatus to couple a device, such as, for example, a surface mount device, with a substrate, such as, for example, a printed circuit, are disclosed. An apparatus, according to one aspect, may include a substrate, a plurality of terminals coupled with the substrate, a conductive bonding material coupled with the plurality of terminals, an electronic device coupled with the conductive bonding material, and a holder that is coupled with the substrate to hold the electronic device. A method, according to one aspect, may include coupling a holder with a substrate such that terminals of the substrate are included in an opening of the holder, mounting an electronic device over the terminals with a conductive bonding material disposed therebetween, heating the conductive bonding material to its melting point, and cooling the conductive bonding material.

BACKGROUND

1. Field

One or more embodiments of the invention relate to a method andapparatus to couple a device, such as, for example, a capacitor, with asubstrate, such as, for example, a printed circuit.

2. Background Information

Capacitors and other devices are may be mounted on printed circuitboards. The capacitors may be physically and electrically coupled withthe printed circuit boards through reflow of a solder.

FIG. 1 is an enlarged cross-sectional view showing how a capacitor 120may be placed on solder bumps 115 that are located on lands 110 of aprinted circuit board 105, according to one aspect. Bumps, pads, orother electrical contacts of the capacitor (not shown) may be accuratelyaligned over the solder bumps and the lands of the printed circuitboard.

The solder may be heated until it melts, which may be referred to asreflow. In practice, it may prove difficult to evenly heat all of thesolder bumps to the melting point temperature at precisely the sametime. Uneven heating of the solder bumps may potentially result in someof the solder bumps melting before others. For example, the right-handsolder bump of FIG. 1 may melt before the left-hand solder bump. Themelted solder may exert forces on the capacitor, such as, for example,due at least in part to surface tension. Such forces may be exerted to alesser extent or not at all by the un-melted solder bump. This mayresult in an unbalanced force on the capacitor, which may potentiallyresult in the capacitor moving relative to one or more of the lands.

This may potentially result in defects. Commonly encountered defectsinclude, but are not limited to, tombstoning and misalignment of thecapacitor.

FIG. 2 is an enlarged cross-sectional view showing how the capacitor maytombstone, according to one aspect. As shown by the arrow, the left-handend of the capacitor may lift off of the left-hand land.

FIG. 3 is an enlarged top-planar view showing how the capacitor maymisalign, according to one aspect. As shown by the arrow, the left-handend of the capacitor may rotate away from the left-hand land.

Manual correction of tombstoning and misalignment may be possible.However, such manual correction may be time consuming, expensive, and/ormay limit production.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The invention may best be understood by referring to the followingdescription and accompanying drawings that are used to illustrateembodiments of the invention. In the drawings:

FIG. 1 is an enlarged cross-sectional view showing how a capacitor maybe placed on solder bumps that are located on lands of a printed circuitboard, according to one aspect.

FIG. 2 is an enlarged cross-sectional view showing how the capacitor maytombstone, according to one aspect.

FIG. 3 is an enlarged top-planar view showing how the capacitor maymisalign, according to one aspect.

FIG. 4 shows an enlarged cross-sectional view of an apparatus includinga substrate, a plurality of terminals, a conductive bonding material, anelectronic device, and a holder to hold the electronic device, accordingto one or more embodiments of the invention.

FIG. 5 shows an enlarged top-planar view of the apparatus of FIG. 4,according to one or more embodiments of the invention.

FIG. 6 shows an assembly including a substrate, terminals coupled withthe substrate, and conductive bonding material coupled with theterminals, according to one or more embodiments of the invention.

FIG. 7 shows an assembly after coupling a holder with the substrate ofthe assembly of FIG. 6, according to one or more embodiments of theinvention.

FIG. 8 shows an assembly after mounting an electronic device over theterminals of FIG. 7 with the conductive bonding material disposedtherebetween, according to one or more embodiments of the invention.

FIG. 9 shows an assembly after heating the assembly of FIG. 8 to formsoftened, melted, and/or reflowed conductive bonding material, accordingto one or more embodiments of the invention.

FIG. 10 shows an assembly after optionally removing the holder of FIG.9, according to one or more embodiments of the invention.

FIG. 11 shows a computer system including a package which may include aholder as disclosed herein, according to one or more embodiments of theinvention.

DETAILED DESCRIPTION

In the following description, numerous specific details are set forth.However, it is understood that embodiments of the invention may bepracticed without these specific details. In other instances, well-knowncircuits, structures and techniques have not been shown in detail inorder to avoid obscuring the understanding of this description.

FIG. 4 shows an enlarged cross-sectional view of an apparatus 400including a substrate 450, a plurality of terminals 455, a conductivebonding material 460, an electronic device 465, and a holder 470 to holdthe electronic device, according to one or more embodiments of theinvention. The terminals are coupled with the substrate. The conductivebonding material is coupled with the terminals. The electronic device iscoupled with the conductive bonding material. The holder is coupled withthe substrate.

In the following description and claims, the terms “coupled” and“connected,” along with their derivatives, may be used. It should beunderstood that these terms are not intended as synonyms for each other.Rather, in particular embodiments, “connected” may be used to indicatethat two or more elements are in direct physical contact with eachother. “Coupled” may mean that two or more elements are in directphysical or electrical contact. However, “coupled” may also mean thattwo or more elements are not in direct contact with each other, but yetstill co-operate or interact with each other. For example, as shown inthe illustrated embodiment, the electronic device may be coupled withthe terminals and/or the substrate through the solder bumps disposedtherebetween.

The substrate may include a substrate including a circuit, such as, forexample, a printed circuit board, printed wiring board, flexible printedcircuit, or other printed circuit, to name just a few examples. In oneaspect, the substrate may be for flip-chip ball grid array (FCBGA),although the scope of the invention is not limited in this respect.

The substrate includes the plurality of terminals coupled therewith andconnected thereto. Suitable terminals include, but are not limited to,lands, pads, vias, interconnects, other conductive materials, andcombinations thereof. A wide variety of terminal designs and/ormetallurgies are known in the arts and are suitable. The illustratedterminals are embedded in the substrate, although the invention is notlimited in this respect. In one or more alternate embodiments, theterminals may overly a surface of the substrate.

The conductive bonding material, such as, for example, a solder, orother metal bonding material, may be coupled with and connected to theplurality of terminals. Suitable solders include, but are not limitedto, tin-lead eutectic solders and lead-free solders, such as, forexample, tin-silver and/or tin-silver-copper solders. The conductivebonding material may be in the form of balls and/or bumps, to name justa few possibilities. The balls or bumps may optionally be coined, suchthat they may have a flattened top (not shown), such as, for example, inorder to help reduce tombstoning and misalignment, although this is notrequired.

The electronic device is coupled with and connected to the conductivebonding material. Suitable electronic devices include, but are notlimited to, passive and active surface mount devices. A surface mountdevice may include a component or other device that may be mounted ontoa substrate using surface mount technology, rather than into a substratewith the use of pins, for example. Non-limiting examples of passivesurface mount devices include capacitors, resistors, and inductors.Specific examples of suitable capacitors include, but are not limitedto, monolithic ceramic capacitors and tantalum capacitors. Specificexamples of suitable resistors include, but are not limited to, thickfilm resistors and thin film resistors. Non-limiting examples of activesurface mount devices include transistors and microelectronic devices,such as, for example, integrated circuits. However, the scope of theinvention is not limited to these particular devices. For example, quadflat-packs, dual in-line packages, gull-wing packages, 0402 arrays (i.e.two or more 0402 components coupled together), and/or other devices mayalso optionally be mounted. Such devices may be mounted or otherwisecoupled with the terminals through the conductive bonding material. Theillustrated electronic device includes a two-terminal device, such as,for example, a capacitor, which is coupled with two terminals of thesubstrate, although the scope of the invention is not limited in thisrespect.

The holder is coupled with and connected to the substrate and may holdthe electronic device in place, such as, for example, during reflow. Theholder may help to keep the electronic device in its intended positionin which it is coupled with the conductive bonding material andterminals. In one aspect, the holder may restrain the electronic deviceto help to prevent, or at least reduce, movement of the electronicdevice, which may potentially lead to defects, such as tombstoningand/or misalignment, for example. In holding the electronic device, inone or more embodiments of the invention, the holder may contact theelectronic device to help to keep it from moving. However, it is notrequired that the holder contact the electronic device, although it may.According to one or more embodiments of the invention, the holder maynot contact the electronic device unless and until the electronic devicestarts to move out of its intended position, at which point the holderand electronic device may contact. As before, the contact may help toprevent, or at least reduce, further movement of the electronic device.In one aspect, such restraint of movement of the electronic device mayhelp to retain coupling of the electronic device with the terminals andreduce defects, such as, for example, tombstoning and/or misalignment.

The illustrated holder includes a film or other layer, which includes acentralized or otherwise interior hole 475, and which is coupled withand connected to the substrate. As used herein, the term layer may referbroadly to a thickness of a material over a region of the substrate. Thelayer may be deposited, laminated, attached, or otherwise coupled withthe substrate.

As shown in FIG. 5, which shows a top-planar view of the apparatus 400,according to one or more embodiments of the invention, the holder 470may include a layer formed over and around a region of the substrate 450that includes the electronic device 465 and/or the terminals 455 (showndashed to illustrate they may be hidden from view by the electronicdevice). In one or more embodiments of the invention, the layer mayinclude an internal opening and form a ring around a periphery of theregion. As used herein, the term “ring” does not necessarily implycircularity. The ring may have a circular, rectangular, square,triangular, polygonal, curvilinear, or other closed plane shape. Forexample, as shown in the illustrated embodiment, the ring may have arectangular shape that may correspond closely to the size and shape ofthe electronic device, which as illustrated may also optionally berectangular. The dimensions of the layer may range from a thin bandclosely conforming to the periphery of the region to a much larger layeroverlying a large region of the substrate. The invention is not limitedto the particular illustration, which is not necessarily drawn to scale.

As well shown in FIG. 1, the holder includes sidewalls 480. As shown inthe illustrated embodiment, the sidewalls may be beveled, inclined,slanted, or otherwise oblique. The oblique sidewalls are notperpendicular to the base, but as illustrated may slant or lean inwardtoward the electronic device and/or the terminals. In one aspect, thesidewalls may form an angle with the horizontal surface of the substratethat may be in the range of from about 60° to 90°, although this is notrequired, nor is it required to have oblique sidewalls.

As further shown, the thickness of the layer or other height of theholder over the horizontal surface of the substrate may be greater thana height of the electronic device as it may be placed on the conductivebonding material. In one aspect, depending upon the size of theelectronic device, the holder may have a thickness or height that is inthe range of from 200 to 500 μm, for example, although the scope of theinvention is not limited in this respect. The sidewalls may includeoverhangs 485. The illustrated overhangs include an angled top of thesidewalls, although this is not required. Other suitable overhangsinclude, but are not limited to, upper ledges, for example.

In one or more embodiments of the invention, the overhangs may not hangover the electronic device at ambient temperatures, such as, forexample, about 25° C., which may provide greater accessibility formounting the electronic device on the conductive bonding material.However, in one or more embodiments of the invention, the overhangs mayhang over the electronic device at elevated temperatures, such as, forexample, at a temperature that may be slightly below a reflowtemperature of the solder or other conductive bonding material, due atleast in part to thermal expansion of the holder in the direction towardthe electronic device.

Compared to strictly perpendicular or vertical sidewalls without anoverhang, the oblique sidewalls and/or overhangs may potentially help torestrain movement of the electronic device. For example, the obliquesidewalls and/or overhangs may help to prevent, or at least reduce, thelifting of an end of the electronic device off of a conductive bondingmaterial, which may potentially help to reduce tombstoning.

A variety of different materials may optionally be included in theholder. In one or more embodiments of the invention, the holder mayinclude an organic material, such as, for example, a polymeric material,that may remain sufficiently solid and thermally stable up to themelting point temperature and/or reflow temperature of the conductivebonding material. Suitable polymers include, but are not limited to,polyimide resins, such as, for example, Kapton® available from Dupont,thermoset bismaleimide resins, polyamide-imides, polyaryletherketones,polyetheretherketones, perfluoroalkoxys, polytetrafluoroethylenes,polyphenylene sulfides, fluorinated ethylene propylenes, andpolyphenylene sulfones. Combinations of these materials are alsosuitable.

In one or more embodiments of the invention, the holder may optionallyinclude a material having a coefficient of thermal expansion that may begreater than that of the substrate, such as, for example, a printedcircuit board, although this is not required. An exemplary printedcircuit board may have a coefficient of thermal expansion of not morethan about 30×10⁻⁶/° C. at alpha1 stage. Suitable materials for theholder which have a coefficient of thermal expansion greater than thisinclude, but are not limited to, perfluoroalkoxy,polytetrafluoroethylene polymers, and perfluoroalkoxy. Including suchmaterials in the holder may help to allow the holder to expand tocontact the electronic device.

FIGS. 6-10 show enlarged cross-sectional views of assembliesrepresenting different stages of a method of mounting an electronicdevice on a substrate, according to one or more embodiments of theinvention. The substrates, terminals, conductive bonding materials,electronic devices, and holders may optionally have some or all of thecharacteristics of the correspondingly named components discussed above.To avoid obscuring certain concepts, the discussion below will primarilyfocus on the different and/or additional structures and characteristics.

FIG. 6 shows an assembly including a substrate 650, terminals 655coupled with the substrate, and conductive bonding material 660 coupledwith the terminals, according to one or more embodiments of theinvention. In one aspect, the conductive bonding material, such as, forexample, the solder, may have been just previously been selectivelycoated or otherwise applied to the lands or other terminals of thesubstrate.

FIG. 7 shows an assembly after coupling a holder 670 with the substrateof the assembly of FIG. 6, according to one or more embodiments of theinvention. As shown, the holder may be coupled with the substrate suchthat the terminals of the substrate are included in an opening of theholder.

In one or more embodiments of the invention, the holder may be coupledwith the substrate through printing, such as, for example, stencilscreen printing. An optional post-printing thermal or other cure mayoptionally be used. Alternatively, in one or more embodiments of theinvention, a preformed holder may be coupled with the substrate. Thepreformed holder may be formed. In one aspect, the preformed holder maybe molded with the shape of the mold used to provide oblique sidewallsand/or overhangs. Then, the preformed holder may be attached to anadhesive, such as, for example, tape. Then, the tape having thepreformed holder attached thereto may be coupled with the substrate,such as, for example, by using pick-and-placed. Alternatively, a stickypreformed holder may be used without a separate adhesive. However, theinvention is not limited to coupling the holder with the substrate bythese approaches.

FIG. 8 shows an assembly after mounting an electronic device 665 overthe terminals of FIG. 7 with the conductive bonding material disposedtherebetween, according to one or more embodiments of the invention. Inmounting the electronic device, the terminals of the electronic devicemay be positioned or registered over the terminals of the substrate. Inthe illustrated embodiment, the conductive bonding material is alreadyover the terminals, although this is not required. In one or morealternate embodiments of the invention, the conductive bonding materialmay be included under the terminals of the electronic device; or elsesome conductive bonding material may be included under the terminals ofthe electronic device and other conductive bonding material may beincluded over the terminals of the substrate.

FIG. 9 shows an assembly after heating the assembly of FIG. 8 to formsoftened, melted, and/or reflowed conductive bonding material 690,according to one or more embodiments of the invention. In one or moreembodiments, the heating may be performed in an oven, although this isnot required. The temperature to which the assembly may be heated maydepend upon the particular conductive bonding material. The reflowtemperature of a tin-lead solder may range from about 220 to 240° C. Thereflow temperature of a tin-silver-type of lead free solder may rangefrom about 240 to 260° C. The scope of the invention is not limited toany known temperature.

The heating and increased temperature may also result in a thermallyexpanded holder 695. As shown in the illustrated embodiment, the holdermay optionally be sized and arranged to contact the electrical device ata temperature just lower than the melting point temperature of thesolder in order to help hold and restrain movement of the electronicdevice that may otherwise occur due at least in part to surface tensionforces. For example, the contact may occur at a temperature of fromabout 1 to 50° C., or 5 to 20° C., lower than the melting pointtemperature, to name just a few examples. After heating, the assemblyincluding the conductive bonding material may then be cooled to hardenand/or solidify the conductive bonding material. The thermally expandedholder may also contract.

FIG. 10 shows an assembly after optionally removing the holder of FIG.9, according to one or more embodiments of the invention. It is notrequired that the holder be removed, although it may be removed incertain embodiments. In one or more embodiments of the invention, theholder may be removed with the use of a deflux solution in a defluxoperation. One suitable deflux solution includes hot water, such as, forexample, deionized water having a temperature of from about 90 to 100°C., which may optionally be applied under pressure. Other suitabledeflux solutions may optionally include one or more solvents. Suitablesolvents include, but are not limited to, chloroflorocarbons, alcohols,mineral spirits, terpenes, and combinations thereof. Organic materialsthat may be included in the holder may have increased solubility anddissolution in deflux solutions including such organic solvents.

However, the invention is not limited to removing the holder by using aconventional deflux solution. The holder may also optionally be removedby contact with a solvent that may be suitable for dissolving theholder, such as, for example, acetone, or another suitable organicsolvent, in one aspect in which the holder includes an organic material.Alternatively, the holder may optionally be removed physically byscraping, or pealing, to name just a few examples.

As discussed above, the holder need not necessarily be removed from thesubstrate, although it may be. In one or more embodiments of theinvention, the substrate having the holder may be used to form amicroelectronic package for a chipset component, such as, for example, amicroprocessor, of a computer system. FIG. 11 shows a computer system1197 including a package 1198, which may include a substrate,microelectronic device, and holder as disclosed herein, according to oneor more embodiments of the invention. The computer system may include adesktop, laptop, or server, to name just a few examples. The package maybe included in the computer system along with other conventionalcomponents, such as, for example, a bus, a processor coupled with thebus, and a memory coupled with the bus. Suitable memories that are usedin some, but not all, computer systems include DRAM, SRAM, and Flashmemories. The computer system may optionally include a graphicscontroller and/or audio device, which may be coupled with the bus.Graphics controllers and/or audio devices are included in some, but notall, computer systems. However, other embodiments of the invention arenot limited to this use. For example, in one or more embodiments of theinvention, the holder may be used to mount a device on a motherboard ordaughterboard, for example.

In the description above, for the purposes of explanation, numerousspecific details have been set forth in order to provide a thoroughunderstanding of the embodiments of the invention. It will be apparent,however, to one skilled in the art, that other embodiments may bepracticed without some of these specific details. In other instances,well-known circuits, structures, devices, and techniques have been shownin block diagram form or without detail in order not to obscure theunderstanding of this description.

Many of the methods are described in their most basic form, butoperations may be added to or deleted from the methods. It will beapparent to those skilled in the art that many further modifications andadaptations may be made. The particular embodiments are not provided tolimit the invention but to illustrate it. The scope of the invention isnot to be determined by the specific examples provided above but only bythe claims below.

In the claims, any element that does not explicitly state “means for”performing a specified function, or “step for” performing a specifiedfunction, is not to be interpreted as a “means” or “step” clause asspecified in 35 U.S.C. Section 112, Paragraph 6. In particular, the useof “step of” in the claims herein is not intended to invoke theprovisions of 35 U.S.C. Section 112, Paragraph 6.

It should also be appreciated that reference throughout thisspecification to “one embodiment”, “an embodiment”, or “one or moreembodiments” means that a particular feature may be included in thepractice of the invention. Similarly, it should be appreciated that inthe foregoing description of exemplary embodiments of the invention,various features are sometimes grouped together in a single embodiment,Figure, or description thereof for the purpose of streamlining thedisclosure and aiding in the understanding of one or more of the variousinventive aspects. This method of disclosure, however, is not to beinterpreted as reflecting an intention that the claimed inventionrequires more features than are expressly recited in each claim. Rather,as the following claims reflect, inventive aspects lie in less than allfeatures of a single foregoing disclosed embodiment. Thus, the claimsfollowing the Detailed Description are hereby expressly incorporatedinto this Detailed Description, with each claim standing on its own as aseparate embodiment of this invention.

While the invention has been described in terms of several embodiments,those skilled in the art will recognize that the invention is notlimited to the embodiments described, but may be practiced withmodification and alteration within the spirit and scope of the appendedclaims. The description is thus to be regarded as illustrative insteadof limiting.

1. An apparatus comprising: a printed circuit board; a plurality oflands on a surface of the printed circuit board; solder coupled with theplurality of lands; a capacitor coupled with the solder; and a layeraround a region of the printed circuit board including the capacitor tohold the capacitor in place during solder reflow, wherein the layercomprises an oblique sidewall including an overhang over the regionincluding the capacitor.
 2. An apparatus comprising: a printed circuitboard; a plurality of lands on a surface of the printed circuit board;solder coupled with the plurality of lands; a capacitor coupled with thesolder; and a layer around a region of the printed circuit boardincluding the capacitor to bold the capacitor in place during solderreflow, wherein the layer comprises a thickness that is greater than aheight of the capacitor as coupled with the solder.
 3. The apparatus ofclaim 1, wherein the layer comprises an organic material.
 4. Anapparatus comprising: a printed circuit board; a plurality of lands on asurface of the printed circuit board; solder coupled with the pluralityof lands; a capacitor coupled with the solder; and a layer around aregion of the printed circuit board including the capacitor to hold thecapacitor in place during solder reflow. wherein the layer comprises amaterial having a coefficient of thermal expansion tat is greater thanthat of the printed circuit board.
 5. The apparatus of claim 1, whereinthe layer comprises a material that is soluble in a deflux solution. 6.The apparatus of claim 1, wherein the layer comprises a polymericmaterial that is thermally stable to a reflow temperature of the solder.7. An apparatus comprising: a substrate; a plurality of terminalscoupled with the substrate; a conductive bonding material coupled withthe plurality of terminals; an electronic device coupled with theconductive bonding material; and a holder that is coupled with thesubstrate to hold the electronic device, wherein the holder comprises amaterial having a coefficient of thermal expansion that is greater thanthat of the substrate.
 8. The apparatus of claim 7, wherein the holdercomprises a material that is soluble in a deflux solution.
 9. Theapparatus of claim 7, wherein the holder comprises a polymeric materialthat is thermally stable up to at least 260°C.
 10. The apparatus ofclaim 7, wherein the substrate comprises a printed circuit board,wherein the conductive bonding material comprises a solder, wherein theelectronic device comprises an electronic device selected from the groupconsisting of a capacitor, a resistor, an inductor, and a transistor,and wherein the holder comprises a layer around a periphery of a regionof the printed circuit board including the electronic device.
 11. Theapparatus of claim 7, wherein the holder comprises a layer around aregion of the substrate including the electronic device.
 12. Theapparatus of claim 11, wherein the layer comprises an oblique sidewall.13. The apparatus of claim 12, wherein the oblique sidewall comprises anoverhang over the region including the electronic device.
 14. Theapparatus of claim 11, wherein the layer comprises a thickness that isgreater than a height of the electronic device as coupled with theconductive bonding material.
 15. The apparatus of claim 7, wherein theholder comprises an organic material.
 16. The apparatus of claim 1,wherein the oblique sidewall slants toward the capacitor.
 17. Theapparatus of claim 1, wherein the oblique sidewall is to contact thecapacitor at a reflow temperature of the solder.
 18. The apparatus ofclaim 1: wherein the layer comprises a thickness that is greater than aheight of the capacitor as coupled with the solder; wherein the layercomprises a material having a coefficient of thermal expansion that isgreater than that of the printed circuit board; and wherein the layercomprises a polymeric material that is thermally stable to a reflowtemperature of the solder.
 19. The apparatus of claim 1, furthercomprising a DRAM memory.